Adeia's complaints say AMD's recent 3D V-Cache processors rely on hybrid bonding, a method for connecting chips by directly joining planarized copper and dielectrics at fine ...

Dish has filed an appeal with the Court of Appeal for the Federal Circuit after the USPTO voided elements of its adaptive ...

Adeia dusts off patents to chase a payout on Ryzen X3D chips Chipmaker AMD has found itself on the receiving end of a lawsuit ...

Our extraordinary "powder keg of talent" can take London to the frontiers of technology - London is already the leading city in Europe for life sciences and artificial intelligence ...

The non-practicing entity is seeking unspecified damages from the chipmaker over 10 supposed patent violations.